Pewter (Solder) Melting point information.
Taken from http://www.logwell.com/ page
on solders.
The temperature range represents the Solidus (low) and the Liquidus(high)
Solidus - Point where solder becomes solid.
Liquidus - Liquid point
Between the two points the alloy becomes more and more plastic
Eutectic - Alloy where the solidus and liquidus are the same. The solder goes
from solid to liquid without the plastic state. Also, the melting point tends to
be lower than other alloy mixes of the same type.
| Alloy | Eutectic | Temps | |
| Sn62Pb36Ag02 | 354-372°F | 179-189°C | |
| Sn60Pb36Ag04 | 354-475°F | 179-246°C | |
| Sn63Pb37 | X | 361°F | 183°C |
| Sn60Pb40 | 361-374°F | 183-190°C | |
| Sn55Pb45 | 361-397°F | 183-203°C | |
| Sn50Pb50 | 361-420°F | 183-214°C | |
| Sn45Pb55 | 361-440°F | 183-225°C | |
| Sn40Pb60 | 361-460°F | 183-238°C | |
| Sn35Pb65 | 361-477°F | 183-247°C | |
| Sn30Pb70 | 361-496°F | 183-258°C | |
| Sn25Pb75 | 361-514°F | 183-268°C | |
| Sn20Pb80 | 361-536°F | 268-302°C | |
| Sn96.5Ag03Cu0.5 | 422-428°F | 217-220°C | |
| Sn96.6Ag3.0Cu0.5 | 422-428°F | 217-220°C | |
| Sn95.5Ag3.8Cu0.7 | 422-430°F | 217-221°C | |
| Sn96.5Ag3.5 | X | 430°F | 221°C |
| Sn96Ag04 | 430-444°F | 221-229°C | |
| Sn95Ag05 | 430-473°F | 221-245°C | |
| Sn99.3Cu0.7 | 440°F | 227°C | |
| Sn100 | 450°F | 232°C | |
| Sn95Sb05 | 450-464°F | 232-240°C | |
| Sn10Pb88Ag02 | 514-570°F | 268-299°C | |
| Sn10Pb90 | 514-576°F | 268-302°C | |
| Sn05Pb92.5Ag2.5 | X | 536°F | 280°C |
| Sn05Pb93.5Ag1.5 | 565-574°F | 296-301°C | |
| Sn05Pb95 | 574-597°F | 301-314°C |
Compiled from http://www.kester.com/en-US/technical/alloy.aspx and http://www.logwell.com/
Fluxes
In the
soldering process, the primary purpose of flux is to prevent oxidation
of the base and filler metals. The solders discussed herein attach well
to copper, but poorly to the various oxides of copper, which form
quickly at soldering temperatures. Rosin based flux is nearly inert at
room temperature, but becomes strongly reducing at elevated
temperatures, preventing the formation of metal oxides. Secondarily,
flux facilitates wetting in the soldering process.
Rosin fluxes can be cleaned up nicely
with Pure Grain Alcohol (PGA), but avoid the Completely Denatured
Alcohol (CDA) typically sold through retail outlets in the United States
since it contains
nasty
denaturing additives. See our
Cleaning
Secrets Revealed page for more information on flux cleaners.
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Low Melt Alloys
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